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Because of the need to assemble boards with surface mount parts, toaster reflow ovens are always a popular project for hobbyists. In this video E3 Embedded showcases our custom built reflow toaster, powered by a PIEP of course, and walks users through the complete process from solder paste application through reflow operation. Unique features of the PIEP controlled oven such as dual heat zones, dual temperature control, and active cooling are also highlighted.
Although toaster reflow oven designs are numerous on the web, E3 Embedded Systems has pushed the envelope with our PIEP based design. In this video, E3 Embedded highlights the many design features of our oven design and also provides useful tips for those who need accurate, repeatable reflow operations. Design features discussed in this video include: use of dual heat zones and temperature sensors, active cooling, and accurate board temperature control by use of a donor board.
The Processor Independent Embedded Platform (PIEP) has many advantages over most products currently on the market. Watch how we highlights the main ways PIEP steps in to makeup for the shortcomings that other products have.
The advantages include processor independence, extraneous peripherals, scalability, flexibility, ease of use, and rugged design.
We dropped the E3 Reflow oven with the PIEP installed showing the durability of our products. The PIEP motherboard acts as a rigid frame holding the processor and all the peripherals in place.
This ensures that peripherals won't come loose during a vital times of operation.